*While supplies last* High Thermal Conductivity Adhesive Sheet (HF-STRA4)
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*While supplies last* You can mount ICs and circuit boards directly onto the heat sink!!
Previously, ICs and circuit boards were mounted to heat sinks by sandwiching them between insulating plates and securing them with screws. However, using this product eliminates the need for components such as insulating plates and screws, and also eliminates the hassle of drilling screw holes. This is a Double-sided adhesive sheet with excellent thermal conductivity and low thermal resistance.It features high bonding strength and offers superior strength and reliability. Since it is A4 size, it can be used on large heat sinks, and for smaller components, it can be cut into any shape with scissors. It offers approximately twice the heat dissipation performance of the HF-S43 (compared to our previous model).
A replacement product is currently under development.
Main Specifications
- Model Number
- HF-STRA4
- RoHS Directive (10 Substances)
- Compliant
- Unit Dimensions
- 200 × 300 × 0.125 mm (excluding release liner)
- Quantity per Pack
- 1 sheet
- Product Dimensions (including packaging, approx.)
- 230 × 340 × 1 mm
- Weight (including packaging, approx.)
- 60 g
- JAN Code
- 4931442544448
- Country of Origin
- Japan
- Caution
- This product is intended for indoor use. Please conduct thorough testing before using it in environments with high temperatures or high humidity. The product may peel off more easily on uneven surfaces or surfaces with significant warping. Store in a cool, dark place away from direct sunlight and ultraviolet (UV) rays.
- Appearance
- White
- Thermal Conductivity
- 1.1 W/m·K
- Dielectric Strength
- 0.5 kV
- Thermal resistance
- 1.8 cm²·K/W at 180°
- Flame resistance
- UL94V-0
- Adhesive
- Pressure-sensitive acrylic adhesive
- Peel strength
- 14.1 N/20 mm (aluminum sheet: A1050)
hfstra4