Heat sinks are being used, but we want to improve heat dissipation.
Do you have any of these issues?
- A heat sink is attached to an electronic component, but the temperature does not drop as much as expected.
Importance of heat dissipation
As electrical and electronic devices become smaller, lighter, and more powerful, thermal management of electronic components is becoming increasingly important.
Use without heat dissipation measures can lead to overheating and thermal runaway, which can cause equipment malfunctions and failures.
Problem Solution
Sanhayato's "Heat Dissipation Products" provide a solution!
However, even if electronic components (heat-generating components) and heat sinks (heat-dissipating components) are bonded together, there is an air layer in the microscopic world because of the unevenness and gaps between the surfaces (planes) of the bonded components. This air layer prevents sufficient heat dissipation.
By inserting Sanhayato's heat dissipation countermeasure product between the heat-generating component and the heat-dissipating component, the air layer can be filled and the heat dissipation effect can be improved.
Sanhayato offers a wide range of products to suit your application and performance.
List of Heat Dissipation Products by Application
Condition | Type | Product | Features |
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Liquid, grease and clay products | Grease type (Non-hardening type) |
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Curing type |
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Clay type |
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Sheet products | Adhesive type |
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Adhesive type |
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In addition to improving heat dissipation, we also want to fix heat dissipating components (e.g. heat sinks)
For use on heat-generating parts with uneven surfaces or bumps
To be used in areas where reworkability is required
Products using thermal radiation (thermal diffusion)
The products introduced above utilize thermal conductivity, but there are also products that utilize thermal radiation (thermal diffusion).
One such product is the heat sink (HF-C1225).
Features of the heat sink (HF-C1225)
- Heat dissipation measures can be taken without using a heat sink by simply affixing it.
- The sheet form allows for heat dissipation measures in a small space and weight reduction.