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Can I make a "board" by myself?

Issue Resolution

Positive film of original drawings or CAD drawings is overlaid on a positive photosensitive substrate.UV exposure → development → etching → drilling → finishingUV exposure → development → etching → drilling → finishing

Step 1: Artwork

Create wiring patterns.

Draw wiring patterns according to the circuit diagram of the board to be created.
In the end, the copper foil will remain on the board according to the pattern drawn here.


  • After the drawing is completed, correct any thin areas or pattern breaks by looking through the light.
    Good or poor light shielding greatly affects the finished board.
  • Make sure the ink is sufficiently dry before moving on to the next process.
Wiring Pattern Creation
Creating Wiring Patterns

Step 2: Exposure

Burn the pattern onto the photosensitive substrate.

Clamp the film and quick-positive photosensitive substrate tightly together and expose with a light box. Work should be performed in a dark room as much as possible.

  • Exposure: Light is shone on areas other than the pattern to make them react (elute) with the developer solution in the next process.


  • Patterns appear during the development process. There is almost no color change in the patterned area after exposure.
  • Do not mistake the reverse side of the film.
  • Make sure that there are no gaps between the film and the photosensitive surface.
  • Exposure time depends on the manufacturing elapsed time of the photosensitive substrate and the light box used. Follow the instructions of the light box.
Burn the pattern onto a photosensitive substrate
Baking the pattern onto the photosensitive substrate

Step 3: Development

Develop the photosensitive substrate.

Place the quick-positive photosensitive substrate after exposure in the developer solution and shake it gently vertically and horizontally.
In about 20 to 30 seconds, the photosensitive agent will dissolve in the areas exposed to light, and a pattern will appear. After the pattern appears, quickly pull the substrate out of the solution and rinse it with water.
Work should be performed in a dark room.


  • The appropriate temperature of the developing solution is around 30℃.
  • Avoid rinsing under running water. Also, wash quickly.
Develop the photosensitive substrate
Development of photosensitive substrate

Step 4: Etching

Etch the photosensitive substrate after exposure.

After developing, the quick positive photosensitive substrate is rinsed with water and then placed in the etchant to dissolve copper foil other than the pattern.
When etching in a vat (resin container), the quick positive photosensitive substrate after development is placed in the etchant and gently shaken in the solution until etching is completed. The working time is about 10 minutes.
After etching is completed, rinse with water to remove any remaining photosensitive film on the substrate.


  • The optimum liquid temperature for etching is around 40°C.
  • Use a sufficient amount of liquid.
Etching of photosensitive substrate
Etching of photosensitive substrate

Step 5: Drilling

Drill holes for component mounting.

After etching is complete, use a drill to drill holes where the parts will be mounted. When drilling, work on a level and stable surface.


  • Use a center punch or similar tool to lightly mark the center of the hole to prevent the drill bit from slipping.
  • Wearing safety glasses is recommended for safety.
Drilling for component mounting
Drilling for component mounting

Step 6: Finishing

Drill holes for mounting parts.

Perform silk printing, through-holes, and external processing, etc., as required.


  • For squeezing in screen printing, do not change the squeegee angle (about 70 degrees) from the start of pulling to the end, and use constant force (printing pressure) and speed.
Silk printing

Quick Positive Photosensitive Substrate Production Guide Movie

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