Sealed substrate (SOP 1.27mm pitch / Max.28 pins) (ICB-051-2)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compatible
• Glass Epoxy (FR-4)
• Single-sided

Prices have been revised from August 1st, 2025.

This is a glass epoxy substrate with a thickness of 0.1mm. Cut it to your desired size with scissors, place it on another board, and solder the parts to use. There are five patterns lined up to convert 1.27mm pitch SOP28 pins to 2.54mm pitch.

Main specifications

Model number

ICB-051-2

RoHS Directive (10 Substances)

correspondence

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Body size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (approx. including packaging)

75 x 180 x 1mm

Weight (approx. including packaging)

5g

JAN Code

4931442095117

country of origin

Japan

Hole diameter

Φ0.9

Finishing treatment

Gold flash plating

Package before Conversion

Flat IC

Pitch before Conversion

1.27mm

Pitch after Conversion

2.54mm

★Products are sold one by one. If you are considering this on a case-by-case basis, please refer to the following.

Number of cases (boxes)

10 small boxes

Small box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

65g

icb0512

Materials related to this product

• Ultra-Thin type PCBDetailed drawing of (SOP 1.27mm pitch/Max. 28 pin) (ICB-051-2)
• Ultra-Thin type PCB(SOP 1.27mm pitch/Max. 28 pin) (ICB-051-2) RoHS warranty