Thermal Potting (TP-L1000)
受注生産
Original price
¥44,000
-
Original price
¥44,000
Original price
¥44,000
¥44,000
-
¥44,000
Current price
¥44,000
(Price including tax)
Protects components and dissipates heat!
This is a high-thermal-conductivity insulating and protective potting compound. It protects components and circuit boards while efficiently dissipating heat generated by the components, thereby contributing to improved component performance and extended service life.It is ideal for applications requiring both protection and heat dissipation, such as EV-related equipment and power supply units. This product contains reduced levels of low-molecular-weight siloxanes. Although it is a room-temperature curing type, heating can shorten the curing time, offering excellent workability.
Main Specifications
- Model Number
- TP-L1000
- RoHS Directive (10 Substances)
- Compliant
- Quantity per Set
- 1 set
- NET
- Base 500 g (217 ml), Hardener 500 g (217 ml)
- Product Dimensions (including packaging, approx.)
- 110 x 130 x 240 mm
- Weight (including packaging, approx.)
- 1.275 kg
- JAN Code
- 4931442428304
- Country of Origin
- Taiwan
- Ingredients
- Main ingredients: Silicone resin, heat-dissipating filler, curing agent; Silicone resin, heat-dissipating filler, curing agent, pigment
- Appearance
- Base: White paste; Hardener: Gray paste
- Thermal Conductivity
- 1.5 W/m·K
- Volume resistivity
- >1.0 × 10¹⁴ Ω·cm
- Dielectric strength
- 14 kV/mm
- Viscosity
- Mixture viscosity (25°C): 5.7 Pa·s
- Hardness (Shore A)
- 10
- Low-molecular-weight siloxane
- 250 ppm (D3–D10)
- Operating temperature range
- -60–180°C
- Hazardous Substances Under the Fire Service Act and Content Levels
- For quantities of 2 m³ or more: Designated Combustible Materials (Flammable Liquids); Base: 217 mL, Hardener: 217 mL
- Tack-free time
- 180 minutes (25°C)
- Curing time
- 24 hours (25°C), 30 minutes (70°C)
- Flame Retardancy
- Equivalent to UL94V-0
tpl1000