Surface Mount Component Removal Kit (Lead-Free Type) (SMD-51)
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Safely remove ICs and connectors from the mounting board
Prices have been revised from August 1st, 2025.
This is a lead-free type of surface-mounted parts removal kit. By mixing the dedicated low melting point (about 80°C) solder with the solder on which the parts were mounted, surface-mounted parts can be easily removed with just one soldering gear you have, whether it is a surface-mounted multi-layer board or a multi-pin IC or connector. The dedicated flux is an RMA (halogen-free) type that is environmentally friendly and has a component-friendly environment. It is also a high viscosity type, making it suitable for reworking SMD parts. This kit can be removed by approximately 1,500 pins. *Cannot be used on parts with terminals on the bottom, such as BGA packages. Use a soldering iron with a thick tip and a large wattage, and a lead-free solder for mounting that melts well.
Main specifications
- Model number
- SMD-51
- RoHS Directive (10 Substances)
- correspondence
- Quantity
- 1 set
- Product size (approx. including packaging)
- 90 x 260 x 30 mm
- Weight (approx. including packaging)
- 130g
- JAN Code
- 4931442570300
- country of origin
- Japan
- Accessories (set contents)
- Special solder: SMD-B05 (16cm x 5 bottles), Special flux: SMD-F25 (2.5ml pack), Solder blotting net: SW #3 (1.5m roll x 1 piece)
- Note
- It cannot be used on parts with terminals on the bottom, such as BGA packages.
- Melting point
- SMD-B series solder: Approx. 80℃
smd51