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Surface Mount Component Mounting Kit (Lead-Free Type) (SMX-52)

Original price ¥4,543 - Original price ¥4,543
Original price
¥4,543
¥4,543 - ¥4,543
Current price ¥4,543
(Prices include tax)

在庫数7

Accurate positioning and clean soldering

This is a lead-free type of surface mount component mounting kit. Better wettability and less solder ball formation than conventional products, allowing easy mounting of both QFP ICs and chip resistors without the need for special tools. Slow curing type adhesive allows slow and accurate positioning. More than 50 100-pin QFP ICs can be mounted with this one kit (reference use example). *This kit has a use-by date. If not used for more than 3 days, store in a refrigerator at 0-10℃.

Main Specifications

Model No.
SMX-52
RoHS Directive (10 substances)
Compliant
Material types
Sn 96.5%, Ag 3%, Cu 0.5
Input
1 set
Product size (including packaging, approx.)
80 x 220 x 50 mm
Weight (including packaging, approx.)
92g
JAN code
4931442570522
Country of origin
Japan
Accessories (Contents of set)
Special cream solder: SMX-B05A x 1, Slow curing adhesive: SMX-G02 x 1, Replacement nozzle: SMX-HN5 x 2, Solderwick: SW #2 x 1
Caution
This product has a use-by date. The expiration date at the time of our shipment is at least 1 month; if not used for more than 3 days, store in a refrigerated place at 0 to 10°C. This product's adhesive is not suitable for use in reflow baths; it cannot be used for parts with terminals on the underside, such as BGA packages.
Melting point
SMX-B series solder: 217 to 219°C
Grain size
20 to 38μm
Solid phase temperature / Liquid phase temperature
217℃/219℃

smx52

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