Surface Mount Component Mounting Kit (Lead-Free Type) (SMX-52)
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Accurate positioning and clean soldering
This is a lead-free type of surface mount component mounting kit. Better wettability and less solder ball formation than conventional products, allowing easy mounting of both QFP ICs and chip resistors without the need for special tools. Slow curing type adhesive allows slow and accurate positioning. More than 50 100-pin QFP ICs can be mounted with this one kit (reference use example). *This kit has a use-by date. If not used for more than 3 days, store in a refrigerator at 0-10℃.
Main Specifications
- Model No.
- SMX-52
- RoHS Directive (10 substances)
- Compliant
- Material types
- Sn 96.5%, Ag 3%, Cu 0.5
- Input
- 1 set
- Product size (including packaging, approx.)
- 80 x 220 x 50 mm
- Weight (including packaging, approx.)
- 92g
- JAN code
- 4931442570522
- Country of origin
- Japan
- Accessories (Contents of set)
- Special cream solder: SMX-B05A x 1, Slow curing adhesive: SMX-G02 x 1, Replacement nozzle: SMX-HN5 x 2, Solderwick: SW #2 x 1
- Caution
- This product has a use-by date. The expiration date at the time of our shipment is at least 1 month; if not used for more than 3 days, store in a refrigerated place at 0 to 10°C. This product's adhesive is not suitable for use in reflow baths; it cannot be used for parts with terminals on the underside, such as BGA packages.
- Melting point
- SMX-B series solder: 217 to 219°C
- Grain size
- 20 to 38μm
- Solid phase temperature / Liquid phase temperature
- 217℃/219℃
smx52