Surface Mount Component Removal Kit (Lead-Free Type) (SMD-51)

Safe removal of ICs and connectors from mounting boards

• Jig and Tool
• Soldering Related Products
• RoHS compliant

Prices have been revised effective July 1, 2023.

This is a lead-free type of surface mount component removal kit. Special low-melting point (about 80°C) solder mixes with the solder that mounted the parts, allowing easy removal of surface-mounted parts with a single soldering iron, even for surface-mounted multilayer boards and multi-pin ICs and connectors. The special flux is an RMA (halogen-free) type that is friendly to the environment and components. The high viscosity type is also suitable for reworking SMD parts. Approximately 1,500 pins can be removed with this single kit. *Cannot be used for components with terminals on the underside, such as BGA packages. Use a soldering iron with a thick tip and high wattage that can sufficiently melt lead-free solder for mounting.

Main Specifications

Model No.

SMD-51

RoHS directive (10 substances)

Compliant

Quantity

1 set

Product size (including packaging, approx.)

90 x 260 x 30 mm

Weight (including packaging, approx.)

130g

JAN code

4931442570300

Country of origin

Japan

Accessories (Contents of set)

Special solder: SMD-B05 (16cm x 5pcs), Special flux: SMD-F25 (2.5ml pack), Solder absorbing net: SW #3 (1.5m roll x 1pc)

Caution

Cannot be used for components with terminals on the underside, such as BGA packages.

Melting point

SMD-B series solder: approx. 80°C

smd51

Materials related to this product

• SDS (Safety Data Sheet) for Surface Mount Component Removal Kit (Lead-Free Type) (SMD-51)
• Instruction Manual for Surface Mount Component Removal Kit (Lead-Free Type) (SMD-51)
• RoHS Certificate for Surface Mount Component Removal Kit (Lead-Free Type) (SMD-51)