*Discontinued → Successor product will be released on December 8, 2023 *Quick Positive Photosensitive Substrates (Polyimide single-sided/80 x 300 x 0.085t) (NZ-M2K)
- Discontinued
This product has a successor product ".QP-M2Kis available.
*Discontinued* Quick Positive Photosensitive Substrate (Polyimide single-sided / 80 x 300 x 0.085t)
- Original PCB Production Tools
- Quick Positive Photosensitive Printed Boards
- RoHS compliant
- Polyimide (flexible substrate)
- Single-sided
The successor product, whose exposure time has been approximately halved, will be released on December 8, 2023. Please replace "NZ" with "QP" in the model number for the same size and substrate product. For details, please refer to the page "Renewal Product Information of "Quick Positive Photosensitive Substrates" (https://shop.sunhayato.co.jp/pages/news20231113).
The flexibility of the polyimide material makes it ideal for use when you want to use the finished printed circuit board in a curled state. Until etching is completed, workability is no different from normal photosensitive substrates because of the reinforcing plate. The product's expiration date is 3 years from the date of manufacture in the unopened package, which also allows for long-term storage. Exposure time varies depending on the number of days elapsed from the date of manufacture of the photosensitive substrate and the exposure machine. Please download the technical data at the bottom of this page and refer to the exposure profile to determine the appropriate exposure amount.
Main Specifications
- Model No.
- NZ-M2K
- RoHS Directive (10 substances)
- Compliant
- Material types
- Polyimide (flexible substrate)
- Double-sided / Single-sided
- Single-sided
- Body size
- 80 x 300 x 0.085t (mm)
- Quantity
- 1 piece
- Product size (including packaging, approx.)
- 110 x 350 x 3 mm
- Weight (including packaging, approx.)
- 55g
- JAN code
- 4931442140206
- Country of origin
- Japan
- Copper foil thickness
- 35μm
- Accessories (Contents of set)
- With 1.0mmt bake reinforcement plate
- Caution
- The flexible substrate is attached to the bake stiffening plate with adhesive. After etching, soak the board and reinforcement board in an alcohol solvent (such as Flux Cleaner) to weaken the adhesion and allow clean peeling (it will be smoother if the board corners are slightly turned before soaking in alcohol solvent). (Before soaking in alcohol-based solvents, turn the corners of the board slightly to make it easier to peel off. Avoid strong light or lights when working. Do not store the product under refrigeration (condensation may form on the surface of the photosensitive substrate).
- Quality retention period
- 36 months from date of manufacture
nzm2k