Copper clad laminated substrate (cut substrate) (glass epoxy double-sided/200 x 250 x 1.6t) (No.35R)

Copper clad laminated substrate (cut substrate)

• Universal Printed Circuits Boards
• Copper Clad Laminated Substrate (Cut Substrate)
• RoHS compliant
• Glass Epoxy (FR-4)
• Double-sided

Double-sided, glass epoxy material cut to 200 x 250 mm. A circuit board can be made by drawing a pattern directly on the copper foil surface with a resist pen and etching. It can also be used as a shield board.

Main Specifications

Model No.

No.35R

RoHS Directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Double-sided

Main unit size

200 x 250 x 1.6t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

210 x 260 x 2 mm

Weight (including packaging, approx.)

180g

JAN code

4931442003518

Country of origin

Japan

Finishing Treatment

Anti-rust treated

Copper foil thickness

35μm

★Products are sold one at a time. Please refer to the following for case-by-case consideration.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

210 x 260 x 20 mm

Small box weight (approx.)

1.9kg

no.35r

Material related to this product

• TDS (Technical Data) for Copper-Clad Laminated Substrate (Cut Substrate) (Glass Epoxy Double-Sided/200 x 250 x 1.6t) (No.35R)
• RoHS Certificate for Copper Clad Laminated Substrate (Cut Substrate) (Glass Epoxy Double-sided / 200 x 250 x 1.6t) (No.35R)