Copper clad laminated substrate (cut substrate) (glass epoxy double-sided / 100 x 200 x 1.6t) (No.32R)

Copper-clad laminated substrate (cut substrate)

• Universal Printed Circuits Boards
• Copper-clad laminated substrate (cut substrate)
• RoHS compatible
• Glass Epoxy (FR-4)
• Double-sided

Prices have been revised from August 1st, 2025.

Double-sided- Glass epoxy material has been cut to 100 x 200 mm. Draw a pattern directly on the copper foil surface with a resist pen and etch it to create a circuit board. It can also be used as a shield plate.

Main specifications

Model number

No.32R

RoHS Directive (10 Substances)

correspondence

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Double-sided

Body size

100 x 200 x 1.6t (mm)

Quantity

1 piece

Product size (approx. including packaging)

110 x 210 x 2mm

Weight (approx. including packaging)

72g

JAN Code

4931442003211

country of origin

Japan

Finishing treatment

Rust-proof treatment

Copper Foil Thickness

35μm

★Products are sold one by one. If you are considering this on a case-by-case basis, please refer to the following.

Number of cases (boxes)

10 small boxes

Small box size (approx.)

110 x 210 x 2mm

Small box weight (approx.)

750g

no.32r

Materials related to this product

• Copper-clad laminated substrate (cut substrate) (glass epoxy)Double-sided/100 x 200 x 1.6t) (No.32R) TDS (technical document)
• Copper-clad laminated substrate (cut substrate) (glass epoxy)Double-sided/100 x 200 x 1.6t) (No.32R) RoHS warranty