Sealed substrate (SMT general-purpose pattern) (ICB-078)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compliant
• Glass Epoxy (FR-4)
• Single-sided
• 0.508 x 1.0mm

Prices have been revised effective July 1, 2023.

This is a glass epoxy substrate with a thickness of 0.1 mm. It can be cut to any size with scissors, placed on top of other boards, and used for soldering components. 0.25 x 0.75 land sizes are lined up horizontally (103) and vertically (83), and can be used as SMT general-purpose patterns.

Main Specifications

Model No.

ICB-078

RoHS directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Pitch

0.508×1.0mm

Body size

50 x 105 x 0.1t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

75 x 180 x 1 mm

Weight (including packaging, approx.)

5g

JAN code

4931442095124

Country of origin

Japan

Hole diameter

Dia. 1.0 (dot pattern)

Finishing treatment

Gold flash plating

Shape

SOP, TSSOP, SOT-23 (ST-74), SOT-323 (SC-70)

Number of Holes

103×83

★Products are sold one at a time. Please refer to the following for case-by-case consideration.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

68g

icb078

Materials related to this product

• Detailed drawing of sealed substrate (SMT general-purpose pattern) (ICB-078)
• RoHS Certificate for seal substrate (SMT general-purpose pattern) (ICB-078)