Sealed substrate (power and ground line pattern) (ICB-062)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compatible
• Glass Epoxy (FR-4)
• Single-sided
• 2.54mm

Prices have been revised from August 1st, 2025.

This is a glass epoxy substrate with a thickness of 0.1mm. Cut it to your desired size with scissors, place it on another board, and solder the parts to use. 2.54mm pitch connecting line pattern,Universal Printed Circuits BoardsCan be used to add power and ground lines.

Main specifications

Model number

ICB-062

RoHS Directive (10 Substances)

correspondence

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Pitch

2.54mm

Body size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (approx. including packaging)

75 x 180 x 1mm

Weight (approx. including packaging)

5g

JAN Code

4931442096206

country of origin

Japan

Hole diameter

Φ0.9

Pattern Land Shape

For adding power and ground lines

Finishing treatment

Gold flash plating

★Products are sold one by one. If you are considering this on a case-by-case basis, please refer to the following.

Number of cases (boxes)

10 small boxes

Small box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

69g

icb062

Materials related to this product

• Ultra-Thin type PCBDetailed drawing of (Power supply/Ground Line Pattern) (ICB-062)
• Ultra-Thin type PCB(Power supply/Ground Line Pattern) (ICB-062) RoHS warranty