Sealed substrate (power and ground line pattern) (ICB-062)
在庫数34
Paper-thin glass epoxy substrate
- Universal Printed Circuits Boards
- Ultra-Thin type PCB
- RoHS compliant
- Glass Epoxy (FR-4)
- Single-sided
- 2.54mm
Prices have been revised effective July 1, 2023.
This is a glass epoxy substrate with a thickness of 0.1mm. Cut to desired size with scissors, place on top of other boards, and solder components. 2.54mm pitch connecting line pattern can be used for adding power and ground lines to universal boards.
Main specifications
- Model No.
- ICB-062
- RoHS Directive (10 substances)
- Compliant
- Material types
- Glass Epoxy (FR-4)
- Double-sided / Single-sided
- Single-sided
- Pitch
- 2.54mm
- Body size
- 55 x 100 x 0.1t (mm)
- Quantity
- 1 piece
- Product size (including packaging, approx.)
- 75 x 180 x 1 mm
- Weight (including packaging, approx.)
- 5g
- JAN code
- 4931442096206
- Country of origin
- Japan
- Hole diameter
- 0.9mm dia.
- Pattern / Land shape
- For power and ground line expansion
- Finish Treatment
- Gold flash plating
★Products are sold one at a time. Please refer to the following if you would like to consider a case-by-case basis.
- Number of cases (boxes)
- 10 pieces in a small box
- Box size (approx.)
- 95 x 190 x 20 mm
- Weight of small box (approx.)
- 69g
icb062