Sealed substrate (SOP 1.27mm pitch / Max.16 pins) (ICB-061)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compliant
• Glass Epoxy (FR-4)
• Single-sided

Prices have been revised effective July 1, 2023.

This is a glass epoxy substrate with a thickness of 0.1 mm. The pattern converts 1.27mm pitch SOP16 pins to 2.54mm pitch.

Main Specifications

Model No.

ICB-061

RoHS Directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Main unit size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

75 x 180 x 1 mm

Weight (including packaging, approx.)

5g

JAN code

4931442096107

Country of origin

Japan

Hole diameter

0.9mm dia.

Pattern / Land shape

Power line in

Finish processing

Gold flash plating

Package before Conversion

SOP

Pitch before Conversion

1.27mm

Pitch after Conversion

2.54mm

Number of pins supported

16 pins

★Products are sold one at a time. Please refer to the following for case-by-case consideration.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

67g

icb061

Material related to this product

• Detailed drawing of sealed substrate (SOP 1.27mm pitch / Max.16 pins) (ICB-061)
• RoHS Warranty for seal PCB (SOP1.27mm pitch / Max.16pin) (ICB-061)