Sealed substrate (SOP 1.27mm pitch / Max. 8 pins) (ICB-060)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compatible
• Glass Epoxy (FR-4)
• Single-sided

Prices have been revised from August 1st, 2025.

This is a glass epoxy substrate with a thickness of 0.1mm. Cut it to your desired size with scissors, place it on another board, and solder the parts to use. This is a pattern that converts 1.27mm pitch SOP8 pins to 2.54mm pitch.

Main specifications

Model number

ICB-060

RoHS Directive (10 Substances)

correspondence

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Body size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (approx. including packaging)

75 x 180 x 1mm

Weight (approx. including packaging)

5g

JAN Code

4931442096008

country of origin

Japan

Hole diameter

Φ0.9

Pattern Land Shape

Power line on

Finishing treatment

Gold flash plating

Package before Conversion

SOP

Pitch before Conversion

1.27mm

Pitch after Conversion

2.54mm

Number of supported pins

8 Pin

★Products are sold one by one. If you are considering this on a case-by-case basis, please refer to the following.

Number of cases (boxes)

10 small boxes

Small box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

66g

icb060

Materials related to this product

• Ultra-Thin type PCBDetailed drawing of (SOP 1.27mm pitch/Max.8 pin) (ICB-060)
• Ultra-Thin type PCB(SOP 1.27mm pitch/Max.8 pin) (ICB-060) RoHS warranty