Sealed substrate (0.65mm pitch / Chip Tr pattern) (ICB-057)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compliant
• Glass Epoxy (FR-4)
• Single-sided

Prices have been revised effective July 1, 2023.

This is a glass epoxy substrate with a thickness of 0.1mm. Cut to desired size with scissors, place on top of other boards, and solder components. 0.65mm pitch chip Tr is converted to 2.54mm pattern.

Main Specifications

Model No.

ICB-057

RoHS directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Main unit size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

75 x 180 x 1 mm

Weight (including packaging, approx.)

5g

JAN code

4931442095704

Country of origin

Japan

Hole diameter

0.9mm dia.

Finishing treatment

Gold flash plating

Package before Conversion

Chip Tr

Pitch before Conversion

Tip Tr0.65mmPitch

Pitch after Conversion

2.54mm

★Products are sold one at a time. If you are interested in case units, please refer to the following.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

66g

icb057

Material related to this product

• Detailed drawing of sealed substrate (0.65mm pitch / Chip Tr pattern) (ICB-057)
• RoHS certificate for seal PCB (0.65mm pitch / Chip Tr pattern) (ICB-057)