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Sealed substrate (Chip CR pattern) (ICB-053)

ネコポス対応
Original price ¥1,188 - Original price ¥1,188
Original price
¥1,188
¥1,188 - ¥1,188
Current price ¥1,188
(Prices include tax)

在庫数65

Paper-thin glass epoxy substrate

This is a glass epoxy substrate with a thickness of 0.1 mm. Cut to desired size with scissors, place on top of other substrates, and solder components. Chip CR pattern/2 types and Chip Tr/3 types (0.95/1.5/4.6mm pitch) are converted to 2.54mm.

Main specifications

Model No.
ICB-053
RoHS Directive (10 substances)
Compliant
Material types
Glass Epoxy (FR-4)
Double-sided / Single-sided
Single-sided
Main unit size
55 x 100 x 0.1t (mm)
Quantity
1 piece
Product size (including packaging, approx.)
75 x 180 x 1 mm
Weight (including packaging, approx.)
5g
JAN code
4931442095308
Country of origin
Japan
Hole diameter
0.9mm dia.
Finishing treatment
Gold flash plating
Package before Conversion
Chip CR / Chip Tr
Pitch before Conversion
Chip CR pattern: 2 types / Chip Tr: 3 types (0.95/1.5/4.6mm)
Pitch after Conversion
2.54mm

★Products are sold one at a time. Please refer to the following if you would like to consider per case.

Number of cases (boxes)
10 pieces in a small box
Box size (approx.)
95 x 190 x 20 mm
Weight of small box (approx.)
66g

icb053

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