Sealed substrate (Chip CR pattern) (ICB-053)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compliant
• Glass Epoxy (FR-4)
• Single-sided

Prices have been revised effective July 1, 2023.

This is a glass epoxy substrate with a thickness of 0.1 mm. Cut to desired size with scissors, place on top of other substrates, and solder components. Chip CR pattern/2 types and Chip Tr/3 types (0.95/1.5/4.6mm pitch) are converted to 2.54mm.

Main specifications

Model No.

ICB-053

RoHS Directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Main unit size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

75 x 180 x 1 mm

Weight (including packaging, approx.)

5g

JAN code

4931442095308

Country of origin

Japan

Hole diameter

0.9mm dia.

Finishing treatment

Gold flash plating

Package before Conversion

Chip CR / Chip Tr

Pitch before Conversion

Chip CR pattern: 2 types / Chip Tr: 3 types (0.95/1.5/4.6mm)

Pitch after Conversion

2.54mm

★Products are sold one at a time. Please refer to the following if you would like to consider per case.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

95 x 190 x 20 mm

Weight of small box (approx.)

66g

icb053

Materials related to this product

• Detailed drawing of sealed substrate (chip CR pattern) (ICB-053)
• RoHS Certificate for seal substrate (Chip CR pattern) (ICB-053)