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Sealed substrate (SOP 1.27mm pitch / Max.28 pins) (ICB-051-2)

ネコポス対応
Original price ¥1,188 - Original price ¥1,188
Original price
¥1,188
¥1,188 - ¥1,188
Current price ¥1,188
(Prices include tax)

在庫数82

Paper-thin glass epoxy substrate

Prices have been revised effective July 1, 2023.

Glass epoxy substrate with a thickness of 0.1mm. Cut to desired size with scissors, place on top of other substrates, and solder components. 1.27mmPitchThere are 5 patterns in a row to convert SOP28 pins to 2.54mm pitch.

Main Specifications

Model No.
ICB-051-2
RoHS Directive (10 substances)
Compliant
Material types
Glass Epoxy (FR-4)
Double-sided / Single-sided
Single-sided
Main unit size
55 x 100 x 0.1t (mm)
Quantity
1 piece
Product size (including packaging, approx.)
75 x 180 x 1 mm
Weight (including packaging, approx.)
5g
JAN code
4931442095117
Country of origin
Japan
Hole diameter
0.9mm dia.
Finishing treatment
Gold flash plating
Package before Conversion
Flat IC
Pitch before Conversion
1.27mm
Pitch after Conversion
2.54mm

★Products are sold one at a time. Please refer to the following if you would like to consider a case-by-case basis.

Number of cases (boxes)
10 pieces in a small box
Box size (approx.)
95 x 190 x 20 mm
Small box weight (approx.)
65g

icb0512

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