*Limited stock*.HEATSINK -5°C Cool(For iPhone 11ProMax/XsMax) (HS5C-CL-11ProMax)
Out of stock
Original price
¥7,843
-
Original price
¥7,843
Original price
¥7,843
¥7,843
-
¥7,843
Current price
¥7,843
(Price including tax)
*Only while supplies last* for iPhone11ProMax
Taking a cue from the heat sinks on electronic circuit boards, the aluminum plate has been made uneven to increase cooling capacity. High-performance heat-conductive sheet is placed on the inside of the case, which is located in the heat sensitive area of the iPhone body, for efficient heat dissipation.See variations for iPhone XsMaxSee variations by compatible models
There are no replacements or successors to this product after it is discontinued.
Main Specifications
- Model No.
- HS5C-CL-11ProMax
- Product size (including packaging, approx.)
- 130 x 210 x 37 mm
- Weight (including packaging, approx.)
- 240g
- JAN code
- 4931442790142
- Country of origin
- Japan
- Compatible Products
- iPhone 11ProMax (also compatible with iPhone XsMax)
- Cautionary Note: The iPhone 11ProMax is not compatible with the iPhone XsMax.
- This product cannot be used with iPhone models other than those listed. Wireless charging (Qi) will not be available when the product is attached. Attaching the product with dust, dirt, etc. adhering to it may not only prevent the product from achieving the specified heat dissipation performance, but may also damage the main body of the smartphone. Please be sure to wipe off any dust or dirt before installing the product. The product does not completely protect the smartphone from scratches and impacts. Do not intentionally drop the product. We do not guarantee any damage or malfunction of the smartphone, damage to internal data, or any other damage that may occur as a result of using this product.
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