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High Thermal Conductivity Adhesive Sheet (HF-STRA4-R)

Original price ¥4,180 - Original price ¥4,180
Original price
¥4,180
¥4,180 - ¥4,180
Current price ¥4,180
(Price including tax)

在庫数19

A sheet capable of securing electronic components and heat-dissipating components and conducting heat

Previously, ICs and circuit boards were mounted to heat sinks by sandwiching them between insulating sheets and securing them with screws. However, using this product eliminates the need for components such as insulating sheets and screws, and also eliminates the hassle of drilling screw holes. This is a Double-sided adhesive sheet with excellent thermal conductivity.It offers high adhesive strength and excellent durability and reliability. Since it is A4 size, it can be used with large heat sinks, and for smaller components, it can be cut to any desired shape with scissors. Because it is silicone-free, there is no risk of contact failure caused by siloxane gas.

Main Specifications

Model Number
HF-STRA4-R
RoHS Directive (10 Substances)
Compliant
Unit Dimensions
200 × 300 × 0.2 mm (excluding release agent)
Quantity per Pack
1 sheet
Product Dimensions (including packaging, approx.)
230 × 340 × 1 mm
Weight (including packaging, approx.)
70 g
JAN Code
4931442544486
Country of Origin
Japan
Caution
This product is intended for indoor use. Please conduct thorough testing before using it in high-temperature or high-humidity environments. The product may peel off easily if applied to uneven surfaces or surfaces with significant warping. Store in a cool, dark place away from direct sunlight and ultraviolet (UV) rays.If the surface of the object to be bonded is below 10°C during application, sufficient bonding strength may not be achieved.
Appearance
White
Thermal Conductivity
1.5 W/m·K
Dielectric strength
15 kV/mm
Operating Temperature Range
-40 to 80°C
Thermal resistance
8.49 °C·cm²/W
Flame Retardancy
Equivalent to UL94V-0
Adhesive
Acrylic-based adhesive
Peel strength
8 N/cm (against stainless steel, after 72 hours)

hfstra4r

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