Sealed substrate (SOP 1.27mm pitch / Max.28 pins) (ICB-051-2)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compliant
• Glass Epoxy (FR-4)
• Single-sided

Prices have been revised effective July 1, 2023.

Glass epoxy substrate with a thickness of 0.1mm. Cut to desired size with scissors, place on top of other substrates, and solder components. 1.27mmPitchThere are 5 patterns in a row to convert SOP28 pins to 2.54mm pitch.

Main Specifications

Model No.

ICB-051-2

RoHS Directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Main unit size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

75 x 180 x 1 mm

Weight (including packaging, approx.)

5g

JAN code

4931442095117

Country of origin

Japan

Hole diameter

0.9mm dia.

Finishing treatment

Gold flash plating

Package before Conversion

Flat IC

Pitch before Conversion

1.27mm

Pitch after Conversion

2.54mm

★Products are sold one at a time. Please refer to the following if you would like to consider a case-by-case basis.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

65g

icb0512

Material related to this product

• Detailed drawing of Sealed PCB (SOP 1.27mm pitch / Max.28 pins) (ICB-051-2)
• RoHS Warranty for Sealed PCB (SOP 1.27mm Pitch / Max.28 pins) (ICB-051-2)