Copper-clad laminated substrate (cut substrate) (glass composite single-sided/200 x 300 x 1.0t) (No.E46)
在庫数93
Copper-clad laminated substrate with a thickness of 1.0mm (cut substrate)
- Universal Printed Circuits Boards
- Copper-clad laminated substrate (cut substrate)
- RoHS compatible
- Glass Composite (CEM-3)
- Single-sided
Prices have been revised from August 1st, 2025.
Single-sided- Glass composite material has been cut to 200 x 300 mm. Draw a pattern directly on the copper foil surface with a resist pen and etch it to create a circuit board. It can also be used as a shield plate.
Main specifications
- Model number
- No.E46
- RoHS Directive (10 Substances)
- correspondence
- Material types
- Glass Composite (CEM-3)
- Double-sided / Single-sided
- Single-sided
- Body size
- 200 x 300 x 1.0t (mm)
- Quantity
- 1 piece
- Product size (approx. including packaging)
- 210 x 310 x 2 mm
- Weight (approx. including packaging)
- 130g
- JAN Code
- 4931442004614
- country of origin
- Japan
- Finishing treatment
- Rust-proof treatment
- Copper Foil Thickness
- 35μm
★Products are sold one by one. If you are considering this on a case-by-case basis, please refer to the following.
- Number of cases (boxes)
- 10 small boxes
- Small box size (approx.)
- 210 x 310 x 20 mm
- Small box weight (approx.)
- 1.4kg
no.e46