Silicone for heat dissipation (100g) (SCH-201)
Paste silicone with high thermal conductivity
Prices have been revised effective July 1, 2023.
This silicone improves thermal conductivity of heat-dissipating parts that can withstand operating environments of up to 200°C. Simply apply a thin layer between the CPU and heat sink to improve thermal conductivity. It is a low-molecular-weight siloxane-reduced product (contact point failure prevention product). Five variations are available in different content amounts.See variations with different content amounts.
Main specifications
- Model No.
- SCH-201
- RoHS Directive (10 substances)
- Compliant
- Quantity
- 1 can
- NET
- 100g (40ml)
- Product size (including packaging, approx.)
- Φ68 x 75mm
- Weight (including packaging, approx.)
- 160g
- JAN code
- 4931442401451
- Country of origin
- Japan
- Ingredients
- Silicone oil, filler
- Appearance
- White grease-like
- Thermal conductivity
- 0.84W/m-K
- Volume resistivity
- 2.0×1014ohm-cm
- Dielectric Constant
- 5.0 (60Hz)
- Dissipation Factor
- 0.006 (60Hz)
- Mixing Consistency
- 290
- Specific Gravity
- 2.45
- Oil release degree
- 0.0wt% (150°C, 24h)
- Loss on heating
- 0.4wt%(150°C, 24h)
- Low molecular weight siloxane
- 30ppm (D)3~D10)
- Operating temperature range
- -50~200℃
- Hazardous materials and content under the Fire Service Law
- For 3 tons or more Designated combustibles (synthetic resins) 100g
- Heat resistance
- 200℃
sch201