Thermal Potting (TP-L1000)
Protects components and dissipates heat!
This is a high-thermal-conductivity insulating and protective Potting Agent. It not only protects components and circuit boards but also efficiently dissipates heat generated by the components, thereby contributing to improved component performance and extended service life. It is ideal for applications requiring both protection and heat dissipation, such as EV-related equipment and power supply units.It offers greater flexibility compared to epoxy-based Potting Agent, reducing the risk of component damage caused by curing shrinkage or thermal expansion differences. Although it is a room-temperature curing type, heating can be used to shorten the curing time. As it is a product with reduced low-molecular-weight siloxanes, it can also be used in applications where contact failure is a concern.
Main Specifications
- Model Number
- TP-L1000
- RoHS Directive (10 Substances)
- Compliant
- Quantity per Set
- 1 set
- NET
- Base 500 g (217 ml), Hardener 500 g (217 ml)
- Product Dimensions (including packaging, approx.)
- 110 x 130 x 240 mm
- Weight (including packaging, approx.)
- 1.275 kg
- JAN Code
- 4931442428304
- Country of Origin
- Taiwan
- Ingredients
- Active Ingredients: Silicone resin, heat-dissipating filler; Hardener: Silicone resin, heat-dissipating filler, curing agent, pigment
- Appearance
- Base: White paste; Hardener: Gray paste
- Thermal Conductivity
- 1.5 W/m·K
- Volume resistivity
- >1.0 × 10¹⁴ Ω·cm
- Dielectric strength
- 14 kV/mm
- Viscosity
- Mixture viscosity (25°C): 5.7 Pa·s
- Hardness (Shore A)
- 10
- Low-molecular-weight siloxane
- 250 ppm (D3–D10)
- Operating temperature range
- -60 to 180°C
- Hazardous Substances Under the Fire Service Act and Content Levels
- For quantities of 2 m³ or more: Designated Combustible Materials (flammable liquids); Base: 217 mL, Hardener: 217 mL
- Tack-free time
- 180 minutes (25°C)
- Curing time
- 24 hours (25°C), 30 minutes (70°C)
- Flame Retardancy
- Equivalent to UL94V-0
tpl1000