Sealed substrate (dot 3 connection pattern) (ICB-052)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compliant
• Glass Epoxy (FR-4)
• Single-sided
• 2.54mm

Prices have been revised effective July 1, 2023.

This is a glass epoxy substrate with a thickness of 0.1mm. Cut to desired size with scissors, place on top of other boards, and solder components. 2.54mm pitch 3-connected dot pattern.

Main Specifications

Model No.

ICB-052

RoHS Directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Pitch

2.54mm

Body size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

75 x 180 x 1 mm

Weight (including packaging, approx.)

5g

JAN code

4931442095209

Country of origin

Japan

Hole diameter

0.9mm dia.

Pattern / Land shape

3-connection dot pattern for IC

Finishing process

Gold flash plating

★Products are sold one at a time. Please refer to the following if you would like to consider the product by the case.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

95 x 190 x 20 mm

Weight of small box (approx.)

68g

icb052

Materials related to this product

• Detailed drawing of sealed substrate (dot 3 connection pattern) (ICB-052)
• RoHS Certificate for seal substrate (dot 3 connection pattern) (ICB-052)