Sealed substrate (SOP 1.27mm pitch / Max. 8 pins) (ICB-060)

Paper-thin glass epoxy substrate

• Universal Printed Circuits Boards
• Ultra-Thin type PCB
• RoHS compliant
• Glass Epoxy (FR-4)
• Single-sided

Prices have been revised effective July 1, 2023.

This is a glass epoxy substrate with a thickness of 0.1 mm. Cut to desired size with scissors, place on top of other boards, and solder components. 1.27mm pitch SOP8 pin to 2.54mm pitch conversion pattern.

Main Specifications

Model No.

ICB-060

RoHS Directive (10 substances)

Compliant

Material types

Glass Epoxy (FR-4)

Double-sided / Single-sided

Single-sided

Main unit size

55 x 100 x 0.1t (mm)

Quantity

1 piece

Product size (including packaging, approx.)

75 x 180 x 1 mm

Weight (including packaging, approx.)

5g

JAN code

4931442096008

Country of origin

Japan

Hole diameter

0.9mm dia.

Pattern / Land shape

Power line in

Finish processing

Gold flash plating

Package before Conversion

SOP

Pitch before Conversion

1.27mm

Pitch after Conversion

2.54mm

Number of pins supported

8 pins

★Products are sold one at a time. Please refer to the following for case-by-case consideration.

Number of cases (boxes)

10 pieces in a small box

Box size (approx.)

95 x 190 x 20 mm

Small box weight (approx.)

66g

icb060

Material related to this product

• Detailed drawing of sealed substrate (SOP 1.27mm pitch / Max. 8 pins) (ICB-060)
• RoHS Warranty for seal PCB (SOP 1.27mm pitch / Max.8 pins) (ICB-060)